The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Jan. 11, 2019
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Sankalp Dayal, Fremont, CA (US);

Vamshi Gangumalla, Saratoga, CA (US);

Zaryab Hamavand, San Jose, CA (US);

Calin Miclaus, San Jose, CA (US);

Assignee:

InvenSense, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G01F 1/88 (2006.01); H05K 7/14 (2006.01); G06F 1/3296 (2019.01); G06F 1/3228 (2019.01);
U.S. Cl.
CPC ...
H05K 7/20209 (2013.01); G01F 1/88 (2013.01); G06F 1/3228 (2013.01); G06F 1/3296 (2013.01); H05K 7/1487 (2013.01); H05K 7/1489 (2013.01); H05K 7/20172 (2013.01); H05K 7/20727 (2013.01); H05K 7/20736 (2013.01); H05K 7/20836 (2013.01);
Abstract

A circuit board cooling system comprises a cooling unit comprising fans, pressures sensors that measure air pressure at their locations, and a sensor processing unit coupled with the pressure sensors. The cooling unit operates according to an operating configuration and generates air flow to cool a portion of a circuit board. The pressure sensors comprise a first pressure sensor located between the portion of the circuit board and the cooling unit; and a second pressure sensor located such that the portion of the circuit board is between the second pressure sensor and the cooling unit. A sensor processing unit is configured to: obtain the air pressure data measured by the plurality of pressure sensors; and adjust the operating configuration of the cooling unit based on a cooling specification and a comparison of the obtained air pressure data measured by the first pressure sensor and the second pressure sensor.


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