The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Aug. 22, 2019
Applicants:

Airbus Operations Gmbh, Hamburg, DE;

Airbus India Operations Private Limited, Bangalore, IN;

Inventors:

Santosh Thukaram, Bangalore, IN;

Shubham Shukla, Bangalore, IN;

Peter Linde, Hamburg, DE;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/12 (2006.01); B32B 37/12 (2006.01); B32B 38/00 (2006.01); B32B 37/00 (2006.01); H05K 1/03 (2006.01); B64F 5/10 (2017.01); H05K 3/46 (2006.01); B64D 45/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/12 (2013.01); B32B 37/0046 (2013.01); B32B 37/1207 (2013.01); B32B 38/145 (2013.01); B64F 5/10 (2017.01); H05K 1/03 (2013.01); H05K 3/4644 (2013.01); B32B 2262/106 (2013.01); B32B 2457/08 (2013.01); B64D 45/02 (2013.01); B64D 2221/00 (2013.01);
Abstract

For the purpose of simple integration of conductor circuits into composite material components, a method and an apparatus for producing composite material components of this kind are proposed, wherein a conductor circuit is printed onto or applied in some other way to a support, is provided with a thermally activatable adhesive and then the support is applied to a blank of the composite material component for joint curing. The curing at high pressure and high temperature creates a strong connection between the conductor circuit and the composite material component.


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