The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Apr. 03, 2017
Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventor:

Kei Hayase, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/36 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 7/20 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 23/3675 (2013.01); H01L 25/18 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 7/209 (2013.01); H02M 7/003 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10545 (2013.01);
Abstract

To provide a switching device driving unit that can shorten a connecting distance between a driver and a semiconductor switching element, while ensuring the insulation between a driver and a cooling device, even in a case of employing a semiconductor switching element which is composed of wide gap semiconductor. The switching device driving unit includes a circuit board, a semiconductor switching element composed of wide band gap semiconductor, a cooling device and a driver. The driver is surface mounted on a second face, which is an opposite side face of a first face which is a face of the circuit board on a side where the cooling device is disposed.


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