The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Aug. 20, 2018
Applicant:

National Taipei University of Technology, Taipei, TW;

Inventors:

Tzu-Wei Chou, Taipei, TW;

Syang-Peng Rwei, Taipei, TW;

Chien-Cheng Chen, Taipei, TW;

Guo-Ming Sung, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); B33Y 80/00 (2015.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/118 (2013.01); B33Y 80/00 (2014.12); H05K 1/0281 (2013.01); H05K 1/032 (2013.01); H05K 1/038 (2013.01); H05K 1/092 (2013.01); H05K 1/115 (2013.01); H05K 1/189 (2013.01); H05K 3/125 (2013.01); H05K 3/1216 (2013.01); H05K 3/1241 (2013.01); H05K 3/285 (2013.01); H05K 3/323 (2013.01); H05K 3/4664 (2013.01); H05K 3/284 (2013.01); H05K 2201/0129 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/068 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/10151 (2013.01); H05K 2203/068 (2013.01);
Abstract

The present invention provides a fabric having a multiple layered circuit thereon integrating with electronic devices. The fabric comprises: a base layer; a plurality of conductive circuit layers; at least one connecting layer having electrically-conductive via-hole(s) and electrically-insulated area covering the area without the via-hole(s) and electrically connecting two conductive circuit layers through the via-hole(s) but electrically insulating the rest of the two conductive circuit layers; one or more than one electrical devices mounted to the conductive circuit layer and connected to circuits on the conductive circuit layer through anisotropic conductive film (ACF); and a water-proof layer disposed on the conductive circuit layer which is the farthest away from the base layer and covering the electrical device(s).


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