The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Mar. 09, 2020
Applicant:
Casio Computer Co., Ltd., Tokyo, JP;
Inventors:
Kenji Iwamoto, Kokubunji, JP;
Satoshi Kurosawa, Tokyo, JP;
Assignee:
CASIO COMPUTER CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/28 (2006.01); H05K 1/03 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 1/0201 (2013.01); H05K 1/029 (2013.01); H05K 1/0287 (2013.01); H05K 1/189 (2013.01); H05K 3/0005 (2013.01); H05K 3/28 (2013.01); H05K 3/4664 (2013.01); H05K 2201/06 (2013.01); H05K 2203/1105 (2013.01);
Abstract
A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.
Quick Actions:
Iwamoto, Kenji. (2021). Microcapsule, sheet material, circuit board, method for manufacturing circuit board, and computer readable storage medium (U.S. Patent No. 10893607). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10893607
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile