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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10893605 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

May. 28, 2019

Textured test pads for printed circuit board testing

Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Michael Richard Fabry, Apple Valley, MN (US);

William Bradford Green, Shakopee, MN (US);

Assignee:

Seagate Technology LLC, Fremont, CA (US);

Attorney:

Kagan Binder, PLLC

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 7/02 (2006.01); H05K 7/06 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/00 (2006.01); G01R 31/02 (2006.01); G01R 31/26 (2020.01); G01R 31/28 (2006.01); H01L 21/00 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 21/60 (2006.01); H01L 21/66 (2006.01); H01L 21/70 (2006.01); H01L 21/82 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H01L 23/544 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0268 (2013.01); G01R 31/2808 (2013.01); G01R 31/2818 (2013.01); H05K 1/111 (2013.01); H05K 3/244 (2013.01);
Abstract

A printed circuit board includes a substrate and at least one electrical circuit provided at least partially on a surface layer of the printed circuit board. The electrical circuit includes an electrical trace that is in electrical connection with a test pad provided for accessibility on the surface layer, the test pad being sized and shaped for probing to test an aspect of the circuit, the test pad having a conductive probe surface that is structured to provide at least one vertical surface that extends from the probe surface toward the surface layer and thus providing an edge between the vertical surface and the probe surface, the probe surface having a coating of a material to protect the conductive probe surface from corrosion.

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