The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Jul. 25, 2017
Applicant:
GM Global Technology Operations Llc, Detroit, MI (US);
Inventors:
Assignee:
GM Global Technology Operations LLC, Detroit, MI (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 15/02 (2006.01); B23K 26/00 (2014.01); B23K 26/352 (2014.01); C23C 4/12 (2016.01); H02K 3/50 (2006.01); H02K 3/14 (2006.01); B23K 26/354 (2014.01); C23C 24/04 (2006.01); C23C 4/08 (2016.01); B23K 11/18 (2006.01); B23K 11/11 (2006.01); B23K 26/0622 (2014.01); B23K 26/282 (2014.01); H02K 1/16 (2006.01); B23K 101/36 (2006.01); B23K 103/12 (2006.01); B23K 101/42 (2006.01); B23K 101/34 (2006.01);
U.S. Cl.
CPC ...
H02K 15/02 (2013.01); B23K 11/115 (2013.01); B23K 11/18 (2013.01); B23K 26/0006 (2013.01); B23K 26/0622 (2015.10); B23K 26/282 (2015.10); B23K 26/352 (2015.10); B23K 26/354 (2015.10); B23K 26/3584 (2018.08); C23C 4/08 (2013.01); C23C 4/12 (2013.01); C23C 24/04 (2013.01); H02K 1/16 (2013.01); H02K 3/14 (2013.01); H02K 3/50 (2013.01); H02K 15/024 (2013.01); B23K 2101/34 (2018.08); B23K 2101/35 (2018.08); B23K 2101/36 (2018.08); B23K 2101/42 (2018.08); B23K 2103/12 (2018.08); H02K 2203/09 (2013.01);
Abstract
Methods of manufacturing electrically conductive copper components for electric devices and method of joining electrically conductive copper components are provided. Each of the electrically conductive copper components are manufactured to include a preexisting coating of joining material located on or adjacent to a joining surface thereof.