The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Oct. 26, 2017
Samtec Inc., New Albany, IN (US);
Jignesh Shah, New Albany, IN (US);
Jean Karlo Williams Barnett, New Albany, IN (US);
Eric Zbinden, Santa Clara, CA (US);
SAMTEC, INC., New Albany, IN (US);
Abstract
An interconnect module, such as a transceiver is configured to mate with a host module that includes first and second electrical connectors. The interconnect module includes first and second pluralities of lands that are spaced from each other. The interconnect module can be mated with the host module such that the first lands mate with the first electrical connector, and the second lands mate with the second electrical connector. As the interconnect module is mated with the host module, the first lands can pass over mating regions of the electrical contacts of the second electrical connector without wiping against the mating regions. The interconnect module can be used in both front panel mount and mid board mount applications.