The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Jul. 22, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Koshi Nishida, Osaka, JP;

Katsuhiko Kishimoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 51/00 (2006.01); C23C 14/50 (2006.01); C23C 14/12 (2006.01); C23C 14/24 (2006.01); C23C 14/04 (2006.01); H01L 51/50 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0011 (2013.01); C23C 14/042 (2013.01); C23C 14/12 (2013.01); C23C 14/24 (2013.01); C23C 14/50 (2013.01); H01L 51/5012 (2013.01); H01L 51/56 (2013.01);
Abstract

The present application provides a vapor deposition method, a deposition mask, and a vapor deposition apparatus that make it possible to reliably and uniformly separate the deposition mask in a short time after vapor deposition is performed using a vapor deposition material. In Step (S), a deposition mask that at least partly has a metal layer (metal support layer) made of a ferromagnetic material is formed. In Step (S), the metal layer of the deposition mask is magnetized by applying an electromagnetic field to the metal layer. In Step (S), the deposition mask and a substrate are aligned with each other, and then the deposition mask is attracted and fixed to an electromagnet with the substrate) therebetween. In Step (S), a vapor deposition source is disposed so as to face the deposition mask, and a vapor deposition material in the vapor deposition source is deposited on the substrate by vaporizing the vapor deposition material. In Step (S), the electromagnet generates a magnetic field to cause the deposition mask to repel the electromagnet, thereby separating both the electromagnet and the substrate from the deposition mask.


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