The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Sep. 26, 2013
Applicant:

Universität Konstanz, Constance, DE;

Inventors:

Axel Herguth, Constance, DE;

Svenja Wilking, Allmendingen, DE;

Assignee:

UNIVERSITÄT KONSTANZ, Constance, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 31/068 (2012.01); H01L 21/677 (2006.01); F27B 9/40 (2006.01); H01L 21/67 (2006.01); F27B 9/06 (2006.01);
U.S. Cl.
CPC ...
H01L 31/1864 (2013.01); F27B 9/066 (2013.01); F27B 9/40 (2013.01); H01L 21/6776 (2013.01); H01L 21/67109 (2013.01); H01L 21/67115 (2013.01); H01L 21/67248 (2013.01); H01L 31/068 (2013.01); H01L 31/1804 (2013.01); H01L 31/1868 (2013.01); Y02E 10/547 (2013.01); Y02P 70/521 (2015.11);
Abstract

According to an example, in a method for producing a photovoltaic element with stabilised efficiency, a silicon substrate may be provided with an emitter layer and electrical contacts, which may be subjected to a stabilisation treatment step. Hydrogen from a hydrogenated silicon nitride layer may be introduced into the silicon substrate, for example, within a zone of maximum temperature. The silicon substrate may then be cooled rapidly in a zone in order to avoid hydrogen effusion. The silicon substrate may then be maintained, for example in a zone within a temperature range of from 230° C. to 450° C. for a period of, for example, at least 10 seconds. The previously introduced hydrogen may thereby assume an advantageous bond state. At the same time or subsequently, a regeneration may be carried out by generating excess minority charge carriers in the substrate at a temperature of at least 90° C., preferably at least 230° C.


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