The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

May. 29, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stephen W. Bedell, Wappingers Falls, NY (US);

Keith E. Fogel, Hopewell Junction, NY (US);

Paul A. Lauro, Brewster, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/20 (2006.01); H01L 29/45 (2006.01); H01L 23/528 (2006.01); H01L 23/532 (2006.01); H01L 21/02 (2006.01); H01L 21/768 (2006.01); H01L 31/0224 (2006.01); H01L 31/0465 (2014.01); H01L 33/00 (2010.01); H01L 21/683 (2006.01); H01L 33/06 (2010.01); H01L 33/32 (2010.01); H01L 33/40 (2010.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 29/2003 (2013.01); H01L 21/02172 (2013.01); H01L 21/6835 (2013.01); H01L 21/7685 (2013.01); H01L 23/528 (2013.01); H01L 23/53209 (2013.01); H01L 23/53257 (2013.01); H01L 23/53261 (2013.01); H01L 29/452 (2013.01); H01L 31/022433 (2013.01); H01L 31/0465 (2014.12); H01L 33/0075 (2013.01); H01L 33/0093 (2020.05); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/40 (2013.01); H01L 21/28 (2013.01); H01L 2221/68381 (2013.01); H01L 2933/0016 (2013.01);
Abstract

A method of making a GaN device includes: forming a GaN substrate; forming a plurality of spaced-apart first metal contacts directly on the GaN substrate; forming a layer of insulating GaN on the exposed portions of the upper surface; forming a stressor layer on the contacts and the layer of insulating GaN; forming a handle substrate on the first surface of the stressor layer; spalling the GaN substrate that is located beneath the stressor layer to separate a layer of GaN and removing the handle substrate; bonding the stressor layer to a thermally conductive substrate; forming a plurality of vertical channels through the GaN to define a plurality of device structures; removing the exposed portions of the layer of insulating GaN to electrically isolate the device structures; forming an ohmic contact layer on the second surface; and forming second metal contacts on the ohmic contact layer.


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