The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Mar. 29, 2019
Applicant:

Google Llc, Mountain View, CA (US);

Inventor:

Scott Kirkman, Menlo Park, CA (US);

Assignee:

Google LLC, Mountain View, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/64 (2006.01); H01L 23/528 (2006.01); H01L 49/02 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/48 (2006.01); H01L 23/58 (2006.01); H01L 23/488 (2006.01); H01L 23/498 (2006.01); H01L 27/07 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 28/40 (2013.01); H01L 23/48 (2013.01); H01L 23/488 (2013.01); H01L 23/498 (2013.01); H01L 23/528 (2013.01); H01L 23/5286 (2013.01); H01L 23/538 (2013.01); H01L 23/5386 (2013.01); H01L 23/58 (2013.01); H01L 23/642 (2013.01); H01L 24/14 (2013.01); H01L 24/17 (2013.01); H01L 24/18 (2013.01); H01L 24/25 (2013.01); H01L 25/18 (2013.01); H01L 27/0288 (2013.01); H01L 27/0629 (2013.01); H01L 27/0733 (2013.01); H05K 1/181 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/381 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A circuit package is provided that includes a substrate having a first side and a second side, an integrated circuit component coupled to the second side of the substrate, and a ball grid array formed on the first side of the substrate, the ball grid array including multiple contact balls arranged in a pattern. Each of a first subset of the contact balls is electrically coupled to a first voltage input of an integrated circuit component, and each of a second subset of the contact balls is electrically coupled to a second voltage input of the integrated circuit component. The package also includes a capacitor mounted to the first side and having a first terminal coupled to a first contact ball in the first subset of the contact balls and a second terminal coupled to a second contact ball in the second subset of the contact balls.


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