The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Aug. 31, 2018
Applicant:
Screen Holdings Co., Ltd., Kyoto, JP;
Inventors:
Akihisa Iwasaki, Kyoto, JP;
Yuya Akanishi, Ismaning, DE;
Assignee:
SCREEN Holdings Co., Ltd., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B01D 19/00 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67253 (2013.01); B01D 19/0005 (2013.01); H01L 21/32134 (2013.01); H01L 21/6708 (2013.01); H01L 21/6715 (2013.01); H01L 21/67017 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/768 (2013.01); H01L 21/02244 (2013.01);
Abstract
A substrate processing method which processes a substrate having a metal layer on a surface thereof includes a metal oxide layer forming step of forming a metal oxide layer formed of one atomic layer or several atomic layers on a surface layer of the metal layer by supplying an oxidizing fluid to the surface of the substrate, and a metal oxide layer removing step of selectively removing the metal oxide layer from the surface of the substrate by supplying an etchant to the surface of the substrate.