The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Jan. 24, 2017
Applicant:

Kabushiki Kaisha Toshiba, Tokyo, JP;

Inventors:

Naoyuki Sanada, Kanagawa, JP;

Shinya Sakurada, Tokyo, JP;

Yosuke Horiuchi, Tokyo, JP;

Masaya Hagiwara, Kanagawa, JP;

Masaki Endo, Tokyo, JP;

Takahiro Terada, Kanagawa, JP;

Hideo Chikaoka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/02 (2006.01); C21D 1/26 (2006.01); H01F 1/055 (2006.01); B22F 3/00 (2006.01); F27D 3/00 (2006.01); B22F 3/16 (2006.01); C22C 38/10 (2006.01); C22C 38/14 (2006.01); C22C 38/16 (2006.01); H02K 1/02 (2006.01); H02K 15/03 (2006.01); H02K 1/27 (2006.01); F27B 5/04 (2006.01); F27D 15/00 (2006.01); F27B 17/00 (2006.01); F27B 9/12 (2006.01); F27B 9/39 (2006.01); F27B 9/38 (2006.01); B22F 3/24 (2006.01); C22C 38/00 (2006.01); H01F 1/053 (2006.01); H02K 21/00 (2006.01); H01F 1/059 (2006.01); C21D 1/00 (2006.01); F27B 9/30 (2006.01);
U.S. Cl.
CPC ...
H01F 41/0266 (2013.01); B22F 3/003 (2013.01); B22F 3/16 (2013.01); B22F 3/24 (2013.01); C21D 1/26 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/10 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); F27B 5/04 (2013.01); F27B 9/12 (2013.01); F27B 9/38 (2013.01); F27B 9/39 (2013.01); F27B 17/0016 (2013.01); F27D 3/0024 (2013.01); F27D 15/00 (2013.01); H01F 1/0536 (2013.01); H01F 1/0557 (2013.01); H02K 1/02 (2013.01); H02K 1/276 (2013.01); H02K 1/2766 (2013.01); H02K 15/03 (2013.01); H02K 21/00 (2013.01); B22F 2003/248 (2013.01); B22F 2301/355 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C21D 1/00 (2013.01); F27B 2009/3066 (2013.01); H01F 1/0596 (2013.01);
Abstract

A method of manufacturing a permanent magnet comprises a solution heat treatment. The solution heat treatment includes: performing a heat treatment at a temperature T; placing a cooling member including a first layer and a second layer on the first layer between the heater and the treatment object so that the first layer faces the treatment object; and transferring the treatment object together with the cooling member to the outside of a heating chamber, and cooling the treatment object until a temperature of the treatment object becomes a temperature lower than a temperature T−200° C. In the step of cooling the treatment object, a cooling rate until the temperature of the treatment object becomes the temperature T−200° C. is 5° C./s or more.


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