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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10890847 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 22, 2016

Pattern forming method, resist pattern, method for manufacturing electronic device, and electronic device

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Toru Tsuchihashi, Haibara-gun, JP;

Wataru Nihashi, Haibara-gun, JP;

Hideaki Tsubaki, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

John S Chu

Int. Cl.
CPC ...
G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); C08F 220/18 (2006.01); G03F 7/004 (2006.01); G03F 7/16 (2006.01); G03F 7/40 (2006.01); C08F 220/20 (2006.01); C08F 220/34 (2006.01); C08F 12/22 (2006.01); C08F 12/24 (2006.01); C08F 212/14 (2006.01); C08F 220/30 (2006.01); C08F 220/38 (2006.01);
U.S. Cl.
CPC ...
G03F 7/325 (2013.01); C08F 220/18 (2013.01); G03F 7/0045 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/0392 (2013.01); G03F 7/0397 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/2037 (2013.01); G03F 7/2059 (2013.01); G03F 7/32 (2013.01); G03F 7/40 (2013.01); C08F 12/22 (2013.01); C08F 12/24 (2013.01); C08F 212/14 (2013.01); C08F 220/1803 (2020.02); C08F 220/1806 (2020.02); C08F 220/20 (2013.01); C08F 220/302 (2020.02); C08F 220/34 (2013.01); C08F 220/382 (2020.02); C08F 2800/10 (2013.01);
Abstract

A pattern forming method includes, in this order, forming a film on a substrate, using an active-light-sensitive or radiation-sensitive resin composition containing a resin (A) which has a repeating unit having a phenolic hydroxyl group, and a repeating unit having a group that decomposes by the action of an acid to generate a carboxyl group, and a compound (B) that generates an acid upon irradiation with active light or radiation; exposing the film; and developing the exposed film using a developer including an organic solvent, in which the developer including an organic solvent contains an organic solvent having 8 or more carbon atoms and 2 or less heteroatoms in the amount of 50% by mass or more.

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