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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10890846 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Sep. 22, 2016

Photosensitive resin composition and cured film prepared therefrom

Applicant:

Rohm and Haas Electronic Materials Korea Ltd., Cheonan, KR;

Inventors:

Jong-Ho Na, Hwaseong, KR;

Geun Huh, Hwaseong, KR;

Jin Kwon, Hwaseong, KR;

Jong Han Yang, Hwaseong, KR;

Assignee:

Rohm and Haas Electronic Materials Korea Ltd, Seoul, KR;

Attorney:

S. Matthew Cairns

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
G03F 7/075 (2006.01); G03F 7/004 (2006.01); G03F 7/022 (2006.01); G03F 7/023 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); H01L 21/3105 (2006.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); C08G 77/18 (2006.01); C08G 77/24 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G03F 7/0046 (2013.01); G03F 7/0226 (2013.01); G03F 7/0233 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/322 (2013.01); G03F 7/40 (2013.01); H01L 21/31056 (2013.01); H01L 27/1248 (2013.01); H01L 27/1288 (2013.01); H01L 27/3258 (2013.01); C08G 77/18 (2013.01); C08G 77/24 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/162 (2013.01);
Abstract

Disclosed herein are a photosensitive resin composition and a cured film prepared therefrom. The photosensitive resin composition introduces a siloxane polymer containing a fluorine atom which has strong water-repellency into a composition including a common siloxane polymer and an epoxy compound, and fluorine groups may be present in the whole region of the cured film so that the water-repellency due to a fluorine component may be maintained even after removing the surface of the cured film is removed via a dry etching process. As a result, the resistance (chemical resistance) to chemicals used in a post-processing can be maximizes to provide a cured film having excellent stability.

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