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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10890813 B1

PDFFull Text
Expired
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 08, 2016

Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor

Applicant:

Omron Corporation, Kyoto, JP;

Inventors:

Wakahiro Kawai, Konan, JP;

Takafumi Bessho, Takatsuki, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:

JCIPRNET

Primary Examiner:

Lauren Nguyen

Int. Cl.
CPC ...
G02F 1/1345 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 23/552 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01); H05K 3/32 (2006.01); H05K 3/28 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13452 (2013.01); H01L 21/565 (2013.01); H01L 23/552 (2013.01); H01L 24/96 (2013.01); H05K 1/092 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/12 (2013.01); H05K 3/32 (2013.01); G02F 2001/133388 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15323 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H05K 3/284 (2013.01); H05K 2201/09118 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/10136 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10507 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1327 (2013.01); H05K 2203/1469 (2013.01);
Abstract

Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step difference near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD () and an IC () are embedded and exposed in a resin molding () in such a manner that a connection electrode () of the LCD () and an electrode of the IC () are positioned on the same plane.

Find Patent Forward Citations

Kawai, Wakahiro. (2021). Electronic device having a first electronic component and a second electronic component connected by wiring, and manufacturing method therefor (U.S. Patent No. 10890813). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10890813

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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