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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10890355 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 22, 2017

Heat pump apparatus

Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Yasumitsu Nomura, Chiyoda-ku, JP;

Shigetoshi Ipposhi, Chiyoda-ku, JP;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Xsensus LLP

Primary Examiner:

Daniel E Namay

Int. Cl.
CPC ...
F24H 4/02 (2006.01); F24H 7/02 (2006.01); F24H 9/20 (2006.01); F25B 6/04 (2006.01); F25B 30/02 (2006.01); F25B 41/04 (2006.01); F28D 20/02 (2006.01);
U.S. Cl.
CPC ...
F24H 4/02 (2013.01); F24H 7/02 (2013.01); F24H 9/2007 (2013.01); F25B 6/04 (2013.01); F25B 30/02 (2013.01); F25B 41/04 (2013.01); F28D 20/021 (2013.01);
Abstract

A heat pump apparatus includes a use-side heat exchanger that causes heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.

Find Patent Forward Citations

Nomura, Yasumitsu. (2021). Heat pump apparatus (U.S. Patent No. 10890355). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10890355

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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