The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Jun. 16, 2016
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Gregg A. Patnode, Woodbury, MN (US);
James P. Endle, New Richmond, WI (US);
Eugene H. Carlson, Apple Valley, MN (US);
Matthew D. Wilding, White Bear Lake, MN (US);
Stephen L. Lieder, Wyoming, MN (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 1/00 (2006.01); E01F 9/512 (2016.01); C09D 4/00 (2006.01); C09D 5/00 (2006.01); C09D 11/00 (2014.01); C09K 3/00 (2006.01); B32B 7/12 (2006.01); B32B 25/04 (2006.01); B32B 25/06 (2006.01); B32B 25/08 (2006.01); B32B 27/08 (2006.01); B32B 27/10 (2006.01); B32B 27/22 (2006.01);
U.S. Cl.
CPC ...
E01F 9/512 (2016.02); B32B 7/12 (2013.01); B32B 25/042 (2013.01); B32B 25/06 (2013.01); B32B 25/08 (2013.01); B32B 27/08 (2013.01); B32B 27/10 (2013.01); B32B 27/22 (2013.01); B32B 2264/10 (2013.01); B32B 2264/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/40 (2013.01); B32B 2307/416 (2013.01); B32B 2307/554 (2013.01); B32B 2307/748 (2013.01); B32B 2405/00 (2013.01);
Abstract
The present disclosure generally relates to non-conformable thermoplastic pavement marking tapes comprising a backing and an adhesive layer adjacent to the backing. In some embodiments, the backing includes an ionic copolymer. In other embodiments, the non-conformable backing has an inelastic deformation of less than 10% at 25° C. In some embodiments, the pavement marking tape is heat-moldable.