The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10889897 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 12, 2021

Filed:

Aug. 31, 2018
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventor:

Naoki Tsukamoto, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); C23C 18/18 (2006.01); C25D 5/56 (2006.01); B32B 15/04 (2006.01); C23C 18/16 (2006.01); C23C 18/20 (2006.01); H05K 3/18 (2006.01); H05K 3/10 (2006.01); H05K 1/11 (2006.01); C23C 18/38 (2006.01); G06F 3/044 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01); C23C 18/30 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1882 (2013.01); B32B 15/04 (2013.01); C23C 18/165 (2013.01); C23C 18/1608 (2013.01); C23C 18/1612 (2013.01); C23C 18/1893 (2013.01); C23C 18/2086 (2013.01); C23C 18/38 (2013.01); C25D 5/56 (2013.01); G06F 3/044 (2013.01); H05K 1/119 (2013.01); H05K 3/06 (2013.01); H05K 3/106 (2013.01); H05K 3/182 (2013.01); H05K 3/4644 (2013.01); C23C 18/30 (2013.01); G06F 2203/04103 (2013.01); H05K 1/0284 (2013.01); H05K 1/0287 (2013.01); Y10T 428/24917 (2015.01);
Abstract

An object of the present invention is to provide a method for easily producing an electroconductive laminate having a three-dimensional shape and having a metal layer disposed thereon (for example, an electroconductive laminate having a three-dimensional shape including a curved surface and a metal layer disposed on the curved surface). Another object of the present invention is to provide a three-dimensional structure with a plated-layer precursor layer, a three-dimensional structure with a patterned plated layer, an electroconductive laminate, a touch sensor, a heat generating member, and a three-dimensional structure. The method for producing an electroconductive laminate of the present invention has a step of obtaining a three-dimensional structure with a plated-layer precursor layer including a three-dimensional structure and a plated-layer precursor layer disposed on the three-dimensional structure and having a functional group capable of interacting with a plating catalyst or a precursor thereof and a polymerizable group; a step of applying energy to the plated-layer precursor layer to form a patterned plated layer; and a step of subjecting the patterned plated layer to a plating treatment to form a patterned metal layer on the plated layer.


Find Patent Forward Citations

Quick Actions:

Tsukamoto, Naoki. (2021). Method for producing electroconductive laminate, three-dimensional structure with plated-layer precursor layer, three-dimensional structure with patterned plated layer, electroconductive laminate, touch sensor, heat generating member, and three-dimensional structure (U.S. Patent No. 10889897). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10889897

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…