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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10889741 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 28, 2018

Fluorocarbon resin composition and prepreg and copper foil substrate using the same

Applicant:

Nan Ya Plastics Corporation, Taipei, TW;

Inventors:

Te-Chao Liao, Taipei, TW;

Hao-Sheng Chen, Taipei, TW;

Chih-Kai Chang, Taipei, TW;

Hung-Yi Chang, Taipei, TW;

Assignee:

NAN YA PLASTICS CORPORATION, Taipei, TW;

Attorney:

Li & Cai Intellectual Property (USA) Office

Primary Examiner:

Ramsey Zacharia

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); C08L 27/18 (2006.01); H05K 1/03 (2006.01); C09K 5/14 (2006.01); C08J 5/24 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01); B32B 15/082 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/20 (2013.01); C08J 5/24 (2013.01); C08L 27/18 (2013.01); H05K 1/024 (2013.01); H05K 1/0373 (2013.01); H05K 3/022 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2327/18 (2013.01); C08J 2427/18 (2013.01); C08J 2427/20 (2013.01); C08J 2429/10 (2013.01); C08L 2203/20 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01); C08L 2205/14 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0257 (2013.01);
Abstract

A fluorocarbon resin composition is applicable to produce high-frequency circuit boards including a polytetrafluoroethylene resin; a fluorine-containing copolymer such as poly fluoroalkoxy and fluorinated ethylene propylene; low molecular-weight PTFE micro-powders and inorganic powders; in particular the temperature of pressing copper foil substrates is lowered from 350° C. to 250° C. via a lowering temperature rate of 1 to 4° C./min to improve the crystallinity of the fluorocarbon resin composition as well as improve the copper foil substrate with a high thermal conductivity and a wide range of dielectric constant.

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