The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2021
Filed:
Nov. 17, 2016
Applicant:
Nippon Polytech Corp., Hachioji, JP;
Inventors:
Assignee:
NIPPON POLYTECH CORP., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/102 (2014.01); C08G 18/42 (2006.01); C08G 18/34 (2006.01); C08G 18/32 (2006.01); C08G 18/66 (2006.01); C08G 18/75 (2006.01); C08G 18/16 (2006.01); C09D 11/037 (2014.01); C08K 3/36 (2006.01); C08K 3/26 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08K 3/34 (2006.01); C09D 175/04 (2006.01); C08L 63/00 (2006.01); C09D 7/40 (2018.01); C08L 75/06 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); C08G 18/168 (2013.01); C08G 18/3215 (2013.01); C08G 18/348 (2013.01); C08G 18/42 (2013.01); C08G 18/4211 (2013.01); C08G 18/6659 (2013.01); C08G 18/758 (2013.01); C08K 3/26 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 75/06 (2013.01); C09D 7/40 (2018.01); C09D 11/037 (2013.01); C09D 175/04 (2013.01); H05K 1/028 (2013.01); H05K 1/0271 (2013.01); H05K 1/0353 (2013.01); H05K 3/4644 (2013.01); C08K 2003/267 (2013.01); H05K 2203/1105 (2013.01);
Abstract
A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.