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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10889729 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 17, 2016

Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same

Applicant:

Nippon Polytech Corp., Hachioji, JP;

Inventors:

Kazuhiko Ooga, Tokyo, JP;

Naoki Murata, Tokyo, JP;

Kai Suzuki, Tokyo, JP;

Assignee:

NIPPON POLYTECH CORP., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ian A Rummel

Int. Cl.
CPC ...
C09D 11/102 (2014.01); C08G 18/42 (2006.01); C08G 18/34 (2006.01); C08G 18/32 (2006.01); C08G 18/66 (2006.01); C08G 18/75 (2006.01); C08G 18/16 (2006.01); C09D 11/037 (2014.01); C08K 3/36 (2006.01); C08K 3/26 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08K 3/34 (2006.01); C09D 175/04 (2006.01); C08L 63/00 (2006.01); C09D 7/40 (2018.01); C08L 75/06 (2006.01);
U.S. Cl.
CPC ...
C09D 11/102 (2013.01); C08G 18/168 (2013.01); C08G 18/3215 (2013.01); C08G 18/348 (2013.01); C08G 18/42 (2013.01); C08G 18/4211 (2013.01); C08G 18/6659 (2013.01); C08G 18/758 (2013.01); C08K 3/26 (2013.01); C08K 3/34 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 75/06 (2013.01); C09D 7/40 (2018.01); C09D 11/037 (2013.01); C09D 175/04 (2013.01); H05K 1/028 (2013.01); H05K 1/0271 (2013.01); H05K 1/0353 (2013.01); H05K 3/4644 (2013.01); C08K 2003/267 (2013.01); H05K 2203/1105 (2013.01);
Abstract

A curable composition for forming an overcoat film for flexible wiring boards, the curable composition being effective in improving adhesion to substrates, low warpage, flexibility, the property of inhibiting wire breakage, and long-term reliability. The curable composition according to the present invention comprises a polyurethane (component a) having carboxyl groups and an aromatic-ring concentration of 0.1-6.5 mmol/g and containing an organic residue derived from a polyisocyanate, a solvent (component b), and a compound (component c) having two or more epoxy groups in the molecule.

Find Patent Forward Citations

Ooga, Kazuhiko. (2021). Curable composition, cured object, overcoat film, coated flexible wiring board, and process for producing same (U.S. Patent No. 10889729). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10889729

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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