The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2021

Filed:

Jan. 28, 2019
Applicant:

Chi Mei Corporation, Tainan, TW;

Inventors:

Hsiu-Ping Shen, Tainan, TW;

Kuan-Lin Hsieh, Tainan, TW;

Assignee:

CHI MEI CORPORATION, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08C 19/25 (2006.01); C08L 83/10 (2006.01); C08L 83/06 (2006.01); C08L 47/00 (2006.01); B60C 1/00 (2006.01); C08K 3/011 (2018.01); C08K 3/08 (2006.01); C08G 77/442 (2006.01); C08G 81/02 (2006.01);
U.S. Cl.
CPC ...
C08C 19/25 (2013.01); B60C 1/0016 (2013.01); C08G 77/442 (2013.01); C08G 81/024 (2013.01); C08K 3/011 (2018.01); C08K 3/08 (2013.01); C08L 47/00 (2013.01); C08L 83/06 (2013.01); C08L 83/10 (2013.01); B60C 1/00 (2013.01); C08K 2003/0812 (2013.01); C08K 2003/0837 (2013.01); C08K 2003/0881 (2013.01); C08L 2312/08 (2013.01);
Abstract

The present disclosure provides a modified polymethylhydrosiloxane, a modified high-cis conjugated diene polymer, and a manufacturing method for the same, and a rubber composition and a tire using the same. The manufacturing method for the modified high-cis conjugated diene polymer comprises: performing a polymerization reaction to form a high-cis conjugated diene polymer; and making the high-cis conjugated diene polymer react with a first modifier, and then react with a condensation accelerator and a second modifier to generate a modified high-cis conjugated diene polymer; wherein the modified high-cis conjugated diene polymer has over 97% of cis-1,4 structure. The second modifier comprises a compound represented by the following formula (1).


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