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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10889054 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Nov. 27, 2017

Sacrificial pyrolysis method for additively manufactured ceramics

Applicant:

Hrl Laboratories, Llc, Malibu, CA (US);

Inventors:

Scott M. Biesboer, Santa Monica, CA (US);

Jacob M. Hundley, Thousand Oaks, CA (US);

Zak C. Eckel, Thousand Oaks, CA (US);

Assignee:

HRL Laboratories, LLC, Malibu, CA (US);

Attorney:

Lewis Roca Rothgerber Christie, LLP

Primary Examiner:

Jacob T Minskey

Assistant Examiner:

Melody Tsui

Int. Cl.
CPC ...
B29C 64/135 (2017.01); B29C 64/245 (2017.01); G03F 7/20 (2006.01); G03F 7/038 (2006.01); C08L 1/02 (2006.01); C08L 23/06 (2006.01); C08L 33/08 (2006.01); C08L 55/02 (2006.01); C08L 67/04 (2006.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); C08L 23/12 (2006.01); G03F 7/00 (2006.01); B29C 64/124 (2017.01); B29C 64/40 (2017.01);
U.S. Cl.
CPC ...
B29C 64/135 (2017.08); B29C 64/124 (2017.08); B29C 64/245 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); C08L 1/02 (2013.01); C08L 23/06 (2013.01); C08L 23/12 (2013.01); C08L 33/08 (2013.01); C08L 55/02 (2013.01); C08L 67/04 (2013.01); G03F 7/0037 (2013.01); G03F 7/0384 (2013.01); G03F 7/70416 (2013.01); B29C 64/40 (2017.08); C08L 2207/062 (2013.01); C08L 2207/066 (2013.01);
Abstract

A sacrificial substrate for use in stereolithography, having a first surface configured to be attached to a build platform, and a second surface of the sacrificial substrate configured to be attached to a photopolymer part. The sacrificial substrate physically separates the build platform and the photopolymer part, and serves as the deposition surface for the photopolymer part in place of the build platform. The sacrificial substrate may be separated from the build platform and then separated from the photopolymer part via pyrolysis, oxidation, or etching to thereby yield the free photopolymer part without subjecting the part to excess physical force or damage.

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