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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10888961 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Sep. 06, 2018

Joining material and method for manufacturing joined body

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Yoshihiro Kawaguchi, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Weiping Zhu

Int. Cl.
CPC ...
B23K 35/26 (2006.01); C22C 9/06 (2006.01); C22C 13/00 (2006.01); B23K 35/22 (2006.01); C22C 13/02 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); B22F 7/06 (2006.01); C22C 1/04 (2006.01); B22F 1/00 (2006.01); B23K 35/30 (2006.01); C22C 9/00 (2006.01); C22C 12/00 (2006.01); B23K 103/18 (2006.01); B23K 103/12 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B23K 35/262 (2013.01); B22F 1/0014 (2013.01); B22F 7/064 (2013.01); B23K 35/0244 (2013.01); B23K 35/22 (2013.01); B23K 35/26 (2013.01); B23K 35/302 (2013.01); C22C 1/0483 (2013.01); C22C 9/06 (2013.01); C22C 13/00 (2013.01); C22C 13/02 (2013.01); H05K 3/3457 (2013.01); B22F 2301/30 (2013.01); B22F 2301/40 (2013.01); B22F 2999/00 (2013.01); B23K 2101/36 (2018.08); B23K 2103/12 (2018.08); B23K 2103/18 (2018.08); C22C 9/00 (2013.01); C22C 12/00 (2013.01); H05K 2201/0272 (2013.01);
Abstract

The joining material of the present invention is a joining material which contains a first metal powder and a second metal powder having a higher melting point than the first metal powder, in which the first metal powder is formed of Sn or an alloy containing Sn, the second metal powder is formed of a Cu—Ni alloy in which a proportion of Ni is 5 wt % or more and 30 wt % or less, a Cu—Ni—Co alloy in which a total of a proportion of Ni and a proportion of Co is 5 wt % or more and 30 wt % or less, or a Cu—Ni—Fe alloy in which a total of a proportion of Ni and a proportion of Fe is 5 wt % or more and 30 wt % or less, and a 90% volume grain size D90 of the second metal powder is 0.1 μm or more.

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