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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10888839 B1

PDFFull Text
Date of Patent:
Jan. 12, 2021

Filed:

Jun. 27, 2016

Average-density-adjustable structure, and material change and selective bonding process using same

Applicant:

Korea University Research and Business Foundation, Seoul, KR;

Inventors:

Jung Bae Kim, Seoul, KR;

Ju Sang Yang, Seoul, KR;

In Seon Lee, Gyeonggi-do, KR;

Han Sol Kim, Gyeonggi-do, KR;

Jong Seong Yim, Chungcheongnam-do, KR;

Assignee:

KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, Seoul, KR;

Attorneys:

Hultquist, PLLC

Steven J. Hultquist

Primary Examiner:

Claire A Norris

Int. Cl.
CPC ...
C12M 1/09 (2006.01); B01D 15/00 (2006.01); B01J 20/26 (2006.01); B01J 20/28 (2006.01); B01J 20/32 (2006.01); B01J 31/00 (2006.01); B01D 53/86 (2006.01); C02F 3/34 (2006.01); B01D 53/02 (2006.01); C12N 11/08 (2020.01); C02F 103/08 (2006.01);
U.S. Cl.
CPC ...
B01J 20/261 (2013.01); B01D 15/00 (2013.01); B01D 53/02 (2013.01); B01D 53/86 (2013.01); B01J 20/28011 (2013.01); B01J 20/28042 (2013.01); B01J 20/28097 (2013.01); B01J 20/321 (2013.01); B01J 20/3204 (2013.01); B01J 20/3221 (2013.01); B01J 20/3223 (2013.01); B01J 20/3282 (2013.01); B01J 31/003 (2013.01); C02F 3/343 (2013.01); C12M 23/56 (2013.01); C12N 11/08 (2013.01); B01D 2253/30 (2013.01); B01D 2255/804 (2013.01); B01D 2255/90 (2013.01); B01D 2257/504 (2013.01); B01D 2257/91 (2013.01); B01J 2220/46 (2013.01); B01J 2220/4812 (2013.01); C02F 2103/08 (2013.01);
Abstract

The present invention relates to an average-density-adjustable structure and more specifically provides a structure the average density of which is adjusted by changing the material of the structure and the size of a void formed therein and which can thereby float on the surface of or in a liquid and can easily bond with or change a material present in a gas or liquid by being equipped with a first material, which is one among an organic catalyst, an inorganic catalyst, a microorganism, and a biomolecule.

Find Patent Forward Citations

Kim, Jung. (2021). Average-density-adjustable structure, and material change and selective bonding process using same (U.S. Patent No. 10888839). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10888839

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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