The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Dec. 05, 2019
Applicant:
Boe Technology Group Co., Ltd., Beijing, CN;
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G09G 3/3225 (2016.01); H01L 27/12 (2006.01); H01L 27/32 (2006.01); H05K 1/02 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); G09G 3/3225 (2013.01); H01L 27/124 (2013.01); H01L 27/32 (2013.01); H01L 27/3279 (2013.01); H05K 1/0296 (2013.01); H05K 5/0017 (2013.01); H05K 2201/09609 (2013.01);
Abstract
A power line structure, an array substrate including the power line structure and a display panel are provided. The power line structure () includes a conductive plate (), the conductive plate () includes a through hole disposing area (), the through hole disposing area () is provided with a plurality of via holes (); in at least one sub-area of the through hole disposing area (), a distribution density of the via holes () increases along a direction of decreasing a current density in the conductive plate ().