logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10887984 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Feb. 05, 2016

Resin composition, prepreg, metal-clad laminate, and wiring board

Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Kazumichi Uchida, Yokohama, JP;

Chie Chikara, Kirishima, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Robert S Jones, Jr

Int. Cl.
CPC ...
H05K 1/03 (2006.01); B32B 15/08 (2006.01); C08J 5/24 (2006.01); C08J 5/04 (2006.01); B32B 27/30 (2006.01); B32B 15/14 (2006.01); B32B 27/28 (2006.01); C08K 5/14 (2006.01); C08K 5/3492 (2006.01); C08L 71/12 (2006.01); B32B 27/18 (2006.01); C08F 290/06 (2006.01); C08K 3/36 (2006.01); H05K 3/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0373 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); B32B 27/18 (2013.01); B32B 27/28 (2013.01); B32B 27/302 (2013.01); C08F 290/062 (2013.01); C08J 5/043 (2013.01); C08J 5/24 (2013.01); C08K 5/14 (2013.01); C08K 5/34924 (2013.01); C08L 71/12 (2013.01); C08L 71/126 (2013.01); H05K 1/0366 (2013.01); B32B 2250/02 (2013.01); B32B 2264/102 (2013.01); B32B 2457/00 (2013.01); C08J 2371/12 (2013.01); C08K 3/36 (2013.01); H05K 3/022 (2013.01);
Abstract

A resin composition contains a component (A) being a polyphenylene ether in which the hydroxy group at an end of the main chain thereof has been modified with an ethylenically unsaturated compound, a component (B) being at least one of triallyl isocyanurate and triallyl cyanurate, and a component (C) being an organic peroxide containing no benzene ring. The component (C) is contained with a proportion of 0.1% to 7% by mass relative to 100% by mass of the total mass of the components (A), (B), and (C).

Find Patent Forward Citations

Quick Actions:

Uchida, Kazumichi. (2021). Resin composition, prepreg, metal-clad laminate, and wiring board (U.S. Patent No. 10887984). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10887984

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…