The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Aug. 29, 2018
Applicants:

Hyundai Motor Company, Seoul, KR;

Kia Motors Corporation, Seoul, KR;

Inventor:

Ilseon Yoo, Seoul, KR;

Assignees:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04R 31/00 (2006.01); H04R 1/04 (2006.01); H04R 3/00 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04S 7/00 (2006.01);
U.S. Cl.
CPC ...
H04R 31/006 (2013.01); H04R 1/04 (2013.01); H04R 3/005 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); H04S 7/00 (2013.01); H04R 2499/13 (2013.01); H04S 2420/01 (2013.01); Y10T 29/49005 (2015.01);
Abstract

A manufacturing method for a microphone is provided. The microphone includes a case that is vibrated by a vibration signal. A sound inlet through which a sound signal is input is formed at a portion of the case and a first sound element is formed in the case at a position corresponding to the sound inlet. The first sound element receives the sound signal and the vibration signal to output a first initial signal. A second sound element is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal. A semiconductor chip is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.


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