The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Feb. 28, 2019
Yazaki Corporation, Tokyo, JP;
Tomoya Sato, Shizuoka, JP;
Kazuhide Takahashi, Shizuoka, JP;
Naoki Ito, Shizuoka, JP;
Yasunori Nabeta, Shizuoka, JP;
YAZAKI CORPORATION, Tokyo, JP;
Abstract
A bonding method for a conductor of an electric wire including a conductor formed of a plurality of strands and a sheath covering the conductor such that the conductor is exposed to a predetermined length. The bonding method includes bonding the strands to each other, the strands being spaced apart from the sheath by a predetermined length. An outer diameter of a middle portion of the conductor between a bonded portion and a portion covered with the sheath gradually decreases toward the bonded portion. A maximum value of an intersection angle between an upper surface of the bonded portion or a longitudinal direction of the electric wire and the strands of the middle portion is smaller than a predetermined angle. The predetermined angle is an angle at which breakage of the strands is prevented when the bonding is performed.