The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Mar. 30, 2016
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Kaoru Miyazaki, Tokyo, JP;
Hirotoshi Sakamoto, Tokyo, JP;
Yousuke Hayakawa, Tokyo, JP;
Rikiya Yamashita, Tokyo, JP;
Takanori Yamashita, Tokyo, JP;
Tsuyoshi Suzuki, Tokyo, JP;
Yoichi Mochizuki, Tokyo, JP;
Kazuhiko Yokota, Tokyo, JP;
Tetsuya Ojiri, Tokyo, JP;
DAI NIPPON PRINTING CO., LTD., Tokyo, JP;
Abstract
Provided is a cell packaging material having a high insulating performance and durability. A cell packaging material comprising a layered body provided with at least a substrate layer, a metal layer, an adhesive layer, and a heat-fusible resin layer in the stated order. The adhesive layer has a resin composition that contains an acid-modified polyolefin and an epoxy resin. In probe displacement amount measurements involving the use of a thermal mechanical analyzer, when a probe is placed on the surface of the adhesive layer at an end part of the cell packaging material and the probe is heated from 40° C. to 220° C., the position of the probe does not drop in relation to the initial value.