The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Nov. 10, 2016
Applicant:

Novaled Gmbh, Dresden, DE;

Inventors:

Tomas Kalisz, Dresden, DE;

Francois Cardinali, Dresden, DE;

Jerome Ganier, Dresden, DE;

Uwe Gölfert, Tharandt, DE;

Vygintas Jankus, Dresden, DE;

Carsten Rothe, Dresden, DE;

Benjamin Schulze, Dresden, DE;

Steffen Willmann, Dresden, DE;

Assignee:

Novaled GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/50 (2006.01); C22C 24/00 (2006.01); C23C 14/12 (2006.01); C23C 14/14 (2006.01); H01L 51/42 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5076 (2013.01); C22C 24/00 (2013.01); C23C 14/12 (2013.01); C23C 14/14 (2013.01); H01L 51/001 (2013.01); H01L 51/002 (2013.01); H01L 51/5092 (2013.01); H01L 51/006 (2013.01); H01L 51/0052 (2013.01); H01L 51/0054 (2013.01); H01L 51/0058 (2013.01); H01L 51/0061 (2013.01); H01L 51/0071 (2013.01); H01L 51/0072 (2013.01); H01L 51/0073 (2013.01); H01L 51/42 (2013.01); Y02E 10/549 (2013.01);
Abstract

Process for preparing a metal containing layer, the process comprising (i) at least one step of co-vaporization, at a pressure which is lower than 10Pa, of a) at least one first metal selected from Li, Na, K, Rb and Cs and b) at least one second metal selected Mg, Zn, Hg, Cd and Te from a metal alloy provided in a first vaporization source which is heated to a temperature between 100° C. and 600° C., and (ii) at least one subsequent step of deposition of the first metal on a surface having a temperature which is below the temperature of the first vaporization source, wherein in step (i), the alloy is provided at least partly in form of a homogeneous phase comprising the first metal and the second metal, electronic devices comprising such materials and process for preparing the same.


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