The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Jun. 26, 2019
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Shuai Zhang, Beijing, CN;

Xiaolong Li, Beijing, CN;

Yueping Zuo, Beijing, CN;

Shantao Chen, Beijing, CN;

Qiuhua Meng, Beijing, CN;

Ming Liu, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 51/52 (2006.01); H01L 27/32 (2006.01); H01L 33/12 (2010.01); H01L 29/78 (2006.01); C08L 63/00 (2006.01); G03F 7/00 (2006.01); H05K 1/02 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); C08L 63/00 (2013.01); G03F 7/0002 (2013.01); H01L 27/323 (2013.01); H01L 27/3244 (2013.01); H01L 51/5253 (2013.01); H05K 1/028 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); H01L 29/7843 (2013.01); H01L 33/12 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/566 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A flexible display panel, a manufacturing method thereof and a display device are provided. The flexible display panel includes: a flexible substrate, a first metal layer formed on the substrate, an insulation layer overlying the first metal layer, and a second metal layer disposed on the insulation layer, wherein a plurality of via holes are provided in the insulation layer, the inner wall of each via hole is covered by a stress buffer layer and the second metal layer is formed on the stress buffer layer and connected to the first metal layer through the via holes.


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