The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Jun. 04, 2018
Applicant:

Korea Institute of Science and Technology, Seoul, KR;

Inventors:

Jin-Sang Kim, Seoul, KR;

Chong-Min Koo, Seoul, KR;

Seung-Hyub Baek, Seoul, KR;

Seong-Keun Kim, Seoul, KR;

Chong-Yun Kang, Seoul, KR;

Soon-Man Hong, Seoul, KR;

Seung-Sang Hwang, Seoul, KR;

Ji-Won Choi, Seoul, KR;

Seok-Jin Yoon, Seoul, KR;

Kwang-Chon Kim, Seoul, KR;

Kyung-Youl Baek, Seoul, KR;

Sang-Ho Cho, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/24 (2006.01); H01L 35/16 (2006.01); C04B 35/547 (2006.01); C04B 35/628 (2006.01); H01L 35/18 (2006.01); C04B 35/58 (2006.01); C04B 35/626 (2006.01); C04B 35/01 (2006.01); C04B 35/645 (2006.01); H01L 35/22 (2006.01); C04B 35/56 (2006.01);
U.S. Cl.
CPC ...
H01L 35/24 (2013.01); C04B 35/01 (2013.01); C04B 35/547 (2013.01); C04B 35/5607 (2013.01); C04B 35/5611 (2013.01); C04B 35/5622 (2013.01); C04B 35/58007 (2013.01); C04B 35/58014 (2013.01); C04B 35/58021 (2013.01); C04B 35/58028 (2013.01); C04B 35/58035 (2013.01); C04B 35/58085 (2013.01); C04B 35/628 (2013.01); C04B 35/6264 (2013.01); C04B 35/62831 (2013.01); C04B 35/62886 (2013.01); C04B 35/645 (2013.01); H01L 35/16 (2013.01); H01L 35/18 (2013.01); H01L 35/22 (2013.01); C04B 2235/3294 (2013.01); C04B 2235/3298 (2013.01); C04B 2235/3817 (2013.01); C04B 2235/3839 (2013.01); C04B 2235/3843 (2013.01); C04B 2235/3852 (2013.01); C04B 2235/3856 (2013.01); C04B 2235/3886 (2013.01); C04B 2235/446 (2013.01); C04B 2235/5292 (2013.01); C04B 2235/5445 (2013.01); C04B 2235/666 (2013.01); C04B 2235/85 (2013.01);
Abstract

Disclosed is a thermoelectric composite material includes a thermoelectric material including crystal grains; and a MXene inserted at boundaries of the crystal grains consisting of the thermoelectric material. Accordingly, the thermoelectric composite material may have a reduced thermal conductivity and an increased electrical conductivity. Furthermore, mechanical properties of the thermoelectric composite material may be improved. Thus, the thermoelectric composite material may improve the thermoelectric ability of a thermoelectric module including the same. A method of manufacturing the thermoelectric composite material includes coating MXene on a surface of a thermoelectric material powder including crystal grains; and sintering the thermoelectric material powder coated with the MXene to form a sintered body including the MXene inserted at boundaries of the crystal grains consisting of the thermoelectric material.


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