The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Apr. 22, 2019
Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Ti-Chung Chang, Miao-Li County, TW;

Chih-Chieh Wang, Miao-Li County, TW;

Chien-Chih Chen, Miao-Li County, TW;

Assignee:

INNOLUX CORPORATION, Miao-Li County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 51/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1244 (2013.01); H01L 23/4985 (2013.01); H01L 27/1218 (2013.01); H01L 27/1262 (2013.01); H01L 51/0097 (2013.01); H01L 2251/5338 (2013.01);
Abstract

The present disclosure is related to an electronic device that includes a display area and a non-display area. The electronic device includes a supporting substrate, a flexible substrate, a first organic insulating layer, a first conductive layer, a second conductive layer, a second organic insulating layer, and a resilient structure. The flexible substrate is disposed on the supporting substrate. The first organic insulating layer is disposed on the flexible substrate. The first conductive layer is disposed on the first organic insulating layer. The second conductive layer is disposed on the first conductive layer. The second organic insulating layer is disposed on the second conductive layer. The resilient structure includes resilient elements disposed between the first conductive layer and the second conductive layer. The first conductive layer alternately contacts the second conductive layer and the resilient elements.


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