The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Sep. 28, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Stefano Oggioni, Milan, IT;

Thomas Brunschwiler, Thalwil, CH;

Gerd Schlottig, Uitikon Waldegg, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/4871 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/49805 (2013.01); H01L 24/10 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 23/3736 (2013.01); H01L 24/03 (2013.01); H01L 24/08 (2013.01); H01L 24/13 (2013.01); H01L 2224/022 (2013.01); H01L 2224/02135 (2013.01); H01L 2224/02205 (2013.01); H01L 2224/02215 (2013.01); H01L 2224/10156 (2013.01); H01L 2224/10165 (2013.01); H01L 2224/10175 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81007 (2013.01); H01L 2224/81009 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81907 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/014 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A solution relating to electronic devices of flip-chip type is provided, which includes at least one chip carrier having a carrier surface, the carrier(s) including one or more contact elements of electrically conductive material on the carrier surface, at least one integrated circuit chip having a chip surface, the chip(s) including one or more terminals of electrically conductive material on the chip surface each one facing a corresponding contact element, solder material soldering each terminal to the corresponding contact element, and a restrain structure around the contact elements for restraining the solder material during a soldering of the terminals to the contact elements. The carrier includes one or more heat dissipation elements of thermally conductive material on the carrier surface facing the chip surface displaced from the terminals, the dissipation elements being free of any solder mask.


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