The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Mar. 13, 2019
Samsung Electronics Co., Ltd., Suwon-si, KR;
Bong Soo Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A fan-out semiconductor package includes: a frame including first to third insulating layers, a first wiring layer disposed on a first surface of the first insulating layer and embedded in the second insulating layer, and a second wiring layer disposed on the third insulating layer, and having a through-hole penetrating through the first to third insulating layers; a semiconductor chip disposed in the through-hole and having an active surface on which connection pads are disposed and an inactive surface opposing the active surface; an encapsulant covering at least portions of each of the frame and the semiconductor chip and filling at least portions of the through-hole; and a connection structure disposed on the frame and the active surface of the semiconductor chip and including redistribution layers electrically connected to the connection pads. The first and second wiring layers are electrically connected to the connection pads.