The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jul. 26, 2019
Applicant:
Ohkuchi Materials Co., Ltd., Kagoshima, JP;
Inventor:
Shunichi Kidoguchi, Kagoshima, JP;
Assignee:
OHKUCHI MATERIALS CO., LTD., Kagoshima, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/52 (2010.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/52 (2013.01);
Abstract
A lead frame for use in an optical semiconductor device has a die pad portion on which an optical semiconductor element is mounted and a lead portion electrically connectable with the optical semiconductor element. A surface on a lead frame substrate forming a part of or an entirety of the die pad portion and the lead portion is laminated with a glossy Ni plating layer having a gloss of 2.0-3.5 and a noble metal plating layer including an Ag plating layer, as an uppermost layer, having a gloss of 1.6 or more.