The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jul. 06, 2018
Siemens Aktiengesellschaft, Munich, DE;
Sheng Zhang, Langfang, CN;
Ji Long Yao, Beijing, CN;
Yan Feng Zhao, Beijing, CN;
Lei Shi, Beijing, CN;
Ze Wei Liu, Beijing, CN;
SIEMENS AKTIENGESELSCHAFT, Munich, DE;
Abstract
Embodiments disclose a radiator component and a heat dissipation system for a power semiconductor device. The radiator component for a power semiconductor device includes a heat dissipation body including an inner-ring substrate, an outer-ring substrate, and a plurality of heat sinks. In an embodiment, the outer-ring substrate surrounds the inner-ring substrate and the plurality of heat sinks are arranged between the inner-ring substrate and the outer-ring substrate. One or more first power semiconductor device arrangement positions are provided on an inner circumferential surface of the inner-ring substrate and one or more second power semiconductor device arrangement positions are arranged on an outer circumferential surface of the outer-ring substrate. The radiator component further includes a fan component. The embodiments can save on space, reduce costs, improve the heat dissipation efficiency, and avoid the problem of disturbances between a plurality of fans.