The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Mar. 28, 2017
Applicant:

Parker-hannifin Corporation, Cleveland, OH (US);

Inventor:

Michael Bunyan, Newburyport, MA (US);

Assignee:

Parker-Hannifin Corporation, Cleveland, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/00 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/34 (2013.01); H01L 23/3672 (2013.01); H01L 23/427 (2013.01);
Abstract

Thermal thermally conductive interfaces are used in electronic devices for heat transfer between, for example, the mating heat transfer surfaces of a heat-generating, electronic component, such as an integrated circuit (IC) chip, and a thermal dissipation member, such as a heat sink or spreader, for the conductive cooling of the electronic component. The thermally conductive interface includes a heat spreading material formed of a flexible, lamellar graphite material having a plurality of coarse perforations therein; and a coating of a thermally-conductive phase change material joined to the surface of the graphite material.


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