The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Apr. 29, 2020
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Smic New Technology Research and Development (Shanghai) Corporation, Shanghai, CN;

Inventors:

Zhi Dong Wang, Shanghai, CN;

Cheng Long Zhang, Shanghai, CN;

Wu Tao Tu, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/02 (2006.01); H01L 21/8234 (2006.01); H01L 23/535 (2006.01); H01L 21/28 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); H01L 29/66 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 27/088 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/823468 (2013.01); H01L 21/0214 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02126 (2013.01); H01L 21/28088 (2013.01); H01L 21/31055 (2013.01); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 21/82345 (2013.01); H01L 21/823418 (2013.01); H01L 21/823431 (2013.01); H01L 21/823456 (2013.01); H01L 21/823475 (2013.01); H01L 23/535 (2013.01); H01L 27/088 (2013.01); H01L 29/42376 (2013.01); H01L 29/4966 (2013.01); H01L 29/4983 (2013.01); H01L 29/517 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/785 (2013.01); H01L 29/7848 (2013.01);
Abstract

Semiconductor device is provided. The semiconductor device includes a base substrate and a first dielectric layer on the base substrate. The first dielectric layer contains a first trench and a second trench passing therethrough, and a width of the second trench is larger than a width of the first trench. The semiconductor device further includes a first gate dielectric layer and a first gate electrode in the first trench. A first recess is on the first gate dielectric layer between the first gate electrode and the first dielectric layer. The semiconductor device further includes a second gate dielectric layer and a second gate electrode in the second trench. A second recess is on the second gate dielectric layer between the second gate electrode and the first dielectric layer. The semiconductor device further includes a first protection layer in the first recess and a second protection layer in the second recess.


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Wang, Zhi. (2021). Semiconductor device (U.S. Patent No. 10886181). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10886181

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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