The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Jan. 26, 2017
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/40 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 33/62 (2010.01); H01L 33/52 (2010.01); H01L 21/56 (2006.01); H01L 33/00 (2010.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4821 (2013.01); H01L 21/4846 (2013.01); H01L 21/4871 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/495 (2013.01); H01L 23/49582 (2013.01); H01L 24/48 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 25/0753 (2013.01); H01L 2224/484 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/00014 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method of producing a surface-mountable multi-chip component includes providing a chip arrangement including a metallic conductor structure exposed at a rear side, a plurality of semiconductor chips and an housing material; and forming a solder stop coating on a rear side of the chip arrangement, wherein the solder stop coating separates connection regions of the conductor structure.