The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Sep. 01, 2017
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Daisuke Shimizu, Kyoto, JP;

Masayuki Otsuji, Kyoto, JP;

Shota Iwahata, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/10 (2006.01); H01L 21/67 (2006.01); H01L 21/304 (2006.01); B24B 57/02 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/304 (2013.01); B08B 3/10 (2013.01); B24B 57/02 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01); H01L 21/68728 (2013.01); H01L 21/68792 (2013.01);
Abstract

A substrate processing method includes a substrate holding step of holding a substrate in which a pattern is defined on one major surface, a charge supply step of supplying a charge of one polarity to the substrate, a first voltage application step of applying, in parallel with the charge supply step, a voltage of the other polarity to a first electrode arranged on the other major surface of the substrate through a dielectric member, a second voltage application step of applying, after the first voltage application step, a voltage of the one polarity to the first electrode while keeping a state where a ground connection of the substrate is released and a drying step of removing, in parallel with the second voltage application step, a liquid from the one major surface of the substrate so as to dry the substrate.


Find Patent Forward Citations

Loading…