The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Feb. 27, 2018
Tdk Corporation, Tokyo, JP;
Yuya Ishima, Tokyo, JP;
Shunji Aoki, Tokyo, JP;
Shinichi Kondo, Tokyo, JP;
Yasushi Matsuyama, Tokyo, JP;
Hajime Azuma, Tokyo, JP;
Yusuke Onezawa, Tokyo, JP;
TDK CORPORATION, Tokyo, JP;
Abstract
An electronic-component manufacturing method is for simultaneously manufacturing a plurality of electronic components each including an element body and a conductor. The electronic-component manufacturing method includes the steps of forming laminates to be the plurality of electronic components on a plurality of regions set apart from each other on a surface of a first substrate, releasing the laminates from the plurality of regions, and performing heat treatment to the laminates. The forming the laminates includes a first step of forming element-body patterns on the plurality of regions and a second step of forming conductor patterns on the plurality of regions. The element-body patterns contain a constituent material of the element bodies and are patterned for the plurality of regions. The conductor patterns contain a constituent material of the conductors and are patterned for the plurality of regions.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile