The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2021
Filed:
Dec. 13, 2017
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventor:
Kaoru Tachibana, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/29 (2006.01); H01F 27/245 (2006.01); H01F 27/28 (2006.01); H01F 41/02 (2006.01); H01F 27/32 (2006.01); H01F 17/00 (2006.01); H01G 4/232 (2006.01); H01C 17/00 (2006.01); H01G 4/30 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01C 1/14 (2006.01); H01C 7/18 (2006.01);
U.S. Cl.
CPC ...
H01F 27/29 (2013.01); H01F 17/0013 (2013.01); H01F 27/245 (2013.01); H01F 27/2804 (2013.01); H01F 27/32 (2013.01); H01F 41/0233 (2013.01); H01G 4/232 (2013.01); H01C 1/14 (2013.01); H01C 7/18 (2013.01); H01C 17/006 (2013.01); H01F 2027/2809 (2013.01); H01G 4/12 (2013.01); H01G 4/228 (2013.01); H01G 4/30 (2013.01);
Abstract
A multilayer electronic component manufacturing method includes forming a multilayer body including a plurality of ceramic layers, and forming a groove by removing a part of a bottom surface of the multilayer body. The method further includes segmenting the multilayer body by dividing the multilayer body into a plurality of chip regions, and forming an outer electrode conductor layer on the bottom surface of the multilayer body after formation of the groove and segmentation.