logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10886037 B1

PDFFull Text
Date of Patent:
Jan. 05, 2021

Filed:

Oct. 24, 2017

Conductor and method of manufacturing the same

Applicant:

Alps Alpine Co., Ltd., Tokyo, JP;

Inventors:

Yui Abe, Miyagi-ken, JP;

Yoshihiro Taguchi, Miyagi-ken, JP;

Mitsuo Bito, Miyagi-ken, JP;

Yoshiyuki Asabe, Miyagi-ken, JP;

Yasuyuki Kitamura, Miyagi-ken, JP;

Tomoyuki Yamai, Miyagi-ken, JP;

Koji Oguma, Miyagi-ken, JP;

Tomofumi Oba, Miyagi-ken, JP;

Assignee:

Alps Alpine Co., Ltd., Tokyo, JP;

Attorney:

Beyer Law Group LLP

Primary Examiner:

Elizabeth A Robinson

Int. Cl.
CPC ...
H01B 5/14 (2006.01); H01B 1/02 (2006.01); H01L 51/00 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); B82Y 30/00 (2011.01); H01L 31/0224 (2006.01); H01L 31/18 (2006.01); C23C 14/34 (2006.01); H01L 51/10 (2006.01); H01L 51/52 (2006.01); B82Y 40/00 (2011.01); H01L 51/44 (2006.01);
U.S. Cl.
CPC ...
H01B 5/14 (2013.01); B82Y 30/00 (2013.01); C23C 14/34 (2013.01); H01B 1/02 (2013.01); H01L 31/0224 (2013.01); H01L 31/022466 (2013.01); H01L 31/1884 (2013.01); H01L 51/0021 (2013.01); H05K 1/09 (2013.01); H05K 3/388 (2013.01); B82Y 40/00 (2013.01); H01L 51/102 (2013.01); H01L 51/442 (2013.01); H01L 51/5206 (2013.01); H05K 2201/0108 (2013.01); H05K 2201/0326 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/0352 (2013.01); H05K 2201/10128 (2013.01); Y02E 10/50 (2013.01); Y10T 428/25 (2015.01); Y10T 428/31663 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A conductor includes (i) a substrate, (ii) a transparent conductive film formed on the substrate and including a silver nanowire, (iii) a metal film formed over the transparent conductive film such that at least a portion thereof overlaps the transparent conductive film, and (iv) a buffer film provided between the transparent conductive film and the metal film, the buffer film having adhesion to each of the transparent conductive film and the metal film, and not impeding conductivity between the transparent conductive film and the metal film. Preferably, the buffer film is formed of an organic material having respective functional groups capable of bonding to the transparent conductive film and the metal film.

Find Patent Forward Citations

Loading…