The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

May. 13, 2019
Applicant:

Impinj, Inc., Seattle, WA (US);

Inventors:

Christopher J. Diorio, Shoreline, WA (US);

Ronald L. Koepp, Seattle, WA (US);

Harley K. Heinrich, Snohomish, WA (US);

Theron Stanford, Seattle, WA (US);

Ronald A. Oliver, Seattle, WA (US);

Assignee:

Impinj, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); G06K 19/07 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07775 (2013.01); G06K 19/0723 (2013.01); G06K 19/07743 (2013.01); G06K 19/07745 (2013.01); G06K 19/07747 (2013.01); H01L 23/49855 (2013.01); H01L 24/95 (2013.01); H01Q 1/2225 (2013.01); H01Q 1/2283 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/13063 (2013.01); Y10T 29/49018 (2015.01);
Abstract

Embodiments are directed to a Radio Frequency Identification (RFID) integrated circuit (IC) having a first circuit block electrically coupled to first and second antenna contacts. The first antenna contact is disposed on a first surface of the IC and the second antenna contact is disposed on a second surface of the IC different from the first surface. A substrate of the RFID IC, or a portion of the IC substrate, electrically couples the first circuit block to at least one of the first and second antenna contacts. The IC includes one or more interfaces or barrier regions that at least partially electrically isolate the first circuit block from the rest of the IC substrate.


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