The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Nov. 21, 2016
Applicant:

Leonhard Kurz Stiftung & Co. KG, Furth, DE;

Inventors:

Matthias Heinrich, Nuremberg, DE;

Andreas Hirschfelder, Furth, DE;

Martin Hahn, Herrieden, DE;

Johannes Schad, Furth, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); G06F 3/041 (2006.01); B32B 7/14 (2006.01); B32B 37/06 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
G06F 3/041 (2013.01); B32B 7/14 (2013.01); B32B 37/06 (2013.01); B32B 37/1292 (2013.01); B32B 2255/205 (2013.01); B32B 2307/202 (2013.01); B32B 2309/02 (2013.01); B32B 2457/208 (2013.01); G06F 2203/04103 (2013.01); G06F 2203/04104 (2013.01);
Abstract

A film, a method for producing a film, the use of a film for application to a target substrate as well as a method for producing an electrical functional element. The film here includes a carrier substrate, an adhesion-promoting layer for applying the film to a target substrate, and at least one electrically conductive layer, wherein the at least one electrically conductive layer forms an electrical functional structure in a functional region, wherein the at least one electrically conductive layer forms at least one contacting structure for contacting the electrical functional structure in at least one contacting region, and wherein the adhesion-promoting layer does not cover the at least one contacting region at least in areas when viewed perpendicularly to a plane spanned by the carrier substrate or wherein the adhesion-promoting layer is applied over the whole surface when viewed perpendicularly to a plane spanned by the carrier substrate.


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