The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Mar. 05, 2019
Applicants:

Diamond Innovations, Inc., Worthington, OH (US);

Baker Hughes Incorporated, Houston, TX (US);

Inventors:

Marc W. Bird, Houston, TX (US);

Andrew Gledhill, Westerville, OH (US);

Assignees:

Baker Hughes Incorporated, Houston, TX (US);

Diamond Innovations, Inc., Worthington, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/56 (2006.01); B24D 18/00 (2006.01); E21B 10/54 (2006.01); E21B 10/50 (2006.01); C22C 29/00 (2006.01); C22C 26/00 (2006.01); B22F 5/00 (2006.01);
U.S. Cl.
CPC ...
E21B 10/56 (2013.01); B24D 18/0009 (2013.01); C22C 26/00 (2013.01); C22C 29/005 (2013.01); B22F 2005/001 (2013.01); C22C 2026/006 (2013.01); C22C 2026/008 (2013.01); E21B 10/50 (2013.01); E21B 10/54 (2013.01);
Abstract

A polycrystalline diamond compact includes a polycrystalline diamond material having a plurality of grains of diamond bonded to one another by inter-granular bonds and an intermetallic gamma prime (γ') or κ-carbide phase disposed within interstitial spaces between the inter-bonded diamond grains. The ordered intermetallic gamma prime (γ′) or κ-carbide phase includes a Group VIII metal, aluminum, and a stabilizer. An earth-boring tool includes a bit body and a polycrystalline diamond compact secured to the bit body. A method of forming polycrystalline diamond includes subjecting diamond particles in the presence of a metal material comprising a Group VIII metal and aluminum to a pressure of at least 4.5 GPa and a temperature of at least 1,000° C. to form inter-granular bonds between adjacent diamond particles, cooling the diamond particles and the metal material to a temperature below 500° C., and forming an intermetallic gamma prime (γ′) or κ-carbide phase adjacent the diamond particles.


Find Patent Forward Citations

Loading…