The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2021

Filed:

Sep. 10, 2015
Applicant:

Massachusetts Institute of Technology, Cambridge, MA (US);

Inventors:

Mitchell David Hsing, Cambridge, MA (US);

Parker Andrew Gould, Cambridge, MA (US);

Martin Arnold Schmidt, Reading, MA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); C23C 14/48 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
C23C 14/34 (2013.01); C23C 14/48 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); H01J 37/3211 (2013.01); H01J 37/32605 (2013.01); H01J 37/32715 (2013.01); H01J 37/32724 (2013.01); H01J 37/32807 (2013.01); H01J 37/32816 (2013.01); H01J 37/32889 (2013.01); H01J 37/34 (2013.01); H01J 37/3411 (2013.01); H01L 21/6719 (2013.01);
Abstract

A substrate processing system that is optimized for the production of smaller volumes of semiconductor components is disclosed. To minimize cost, the substrate processing system is designed to accommodate smaller substrates, such as substrates having a diameter of roughly one inch. Additionally, the components of the substrate processing system are designed to be interchangeable, thereby further reducing cost and complexity. In certain embodiments, the substrate processing system comprises a lower assembly, which may be used with one or more upper assemblies. The lower assembly is used to support the substrate and provide many of the fluid, electrical, and sensor connections, while the upper assemblies include the apparatus required to perform a certain fabrication function. For example, different upper assemblies may exist for deposition, etching, sputtering and ion implantation.


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